Schreiner has developed the next generation of its COLOR LASER FILM marking system. A new composition of the CLF layers enhances counterfeiting protection due to specific interactions that occur during the laser marking process.

Nothing’s impossible, says a well-known advertising slogan. Schreiner ProTech could now claim the same. In response to a customer inquiry for a solution to fix a component in position, the business unit developed the smallest adhesive die-cut part ever created at Schreiner Group.

Creating a tangible experience of the benefits of digitalization: that was what the 2017 HANNOVER MESSE promised its visitors—and impressively delivered on its promise last week. Our Schreiner ProTech business unit was represented at the world’s leading industrial trade show as well, having presented its solutions and services centered on secure product marking and digital transformation. The lineup showcased at the shared VDMA booth billed as “Industrial Security” was focused on hot topics such as Product Authentication, Track & Trace and Product Lifecycle Management.

In recent months, our blog series focused on bonding has shown that manufacturing industries frequently use double-sided adhesive die-cut parts (DSAP) to join two components together. This post illustrates how DSAP application works.

Bonding solutions using self-adhesive die-cut parts from Schreiner ProTech perform three key functions: fastening, protection and height compensation. In this post, we’re presenting various field application examples.

Self-adhesive die-cut parts from Schreiner ProTech are the solution to many challenges in the field of joining and fastening. Pressure-sensitive adhesives clearly simplify and accelerate manufacturing and application processes and offer additional benefits. In this post, we’re going to look at what makes our bonding solutions so special.

“Digitization of mobility“ is a topic that runs like a common thread through the International Suppliers Fair (IZB) held in Wolfsburg this week. Our colleagues from Schreiner ProTech (Hall 3, Stand 3217) are right in the middle of the trade fair line-up. As a supplier of RFID labels to VW’s innovative “Transparent Prototype“ project, our business unit is right in line with this trend.

From A as in attaching to S as in sealing: precision die-cut parts are the solution to many challenges and help optimize processes and cut costs. Schreiner ProTech selects and uses the suitable materials and geometries depending on the application.

Readers having followed our series of blog posts in recent weeks have learned that Schreiner ProTech concentrates on pressure-sensitive adhesives (PSA). The reason is that they offer clear processing advantages over liquid adhesive systems. So, could this be the right solution for your application as well? You’ll know after answering the following questions!

The technical magazine “RFID im Blick” (“Focus on RFID”) invites technology providers and everybody with an interest in optimizing their processes with RFID technology to the two-day conference “RFID tomorrow” in Düsseldorf on September 19-20, 2016. Frank Linti, Business Development Manager RFID from our Competence Center will be on site. At the trade booth, he will be talking to sales prospects. In one of 35 SpeedLabs he will present special label developments, which will give companies in the